Browsing by Author Hirman, M.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
| 2019 | Improvement of thick printed copper substrates solderability by formic acid | Michal, D.; Hirman, M.; Řeboun, J. |
| 2020 | Mechanical Testing of Joints Glued/Soldered on Textile Ribbons | Hirman, M.; Navrátil, J.; Hamáček, A.; Steiner, F. |
| 2019 | Optimization of apertures shapes in stencil for eca printing to connecting of smd components on pcbs | Hirman, M.; Steiner, F. |
| 2016 | Temperature stable solder pastes: properties and reliability | Steiner, F.; Stuna, J.; Hirman, M. |
