| Title: | The increasing importance of the thermal management for modern electronic packages |
| Authors: | Psota, Boleslav Szendiuch, Ivan |
| Citation: | Electroscope. 2012, č. 6, EDS 2012. |
| Issue Date: | 2012 |
| Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://147.228.94.30/images/PDF/Rocnik2012/Cislo6_2012/r6c6c6.pdf http://hdl.handle.net/11025/1047 |
| ISSN: | 1802-4564 |
| Keywords: | teplotní management;elektronické pakety |
| Keywords in different language: | electronic packages;thermal management |
| Abstract in different language: | This paper deals with the significance of the thermal management for some modern types of electronic packages. The main part is focused on the Quad-Flat No-leads (QFN) package and its mounting ways and means, which depends significantly on their thermal characteristic. Apart from that, thermal properties of the Ball Grid Array (BGA) package were also calculated as well as thermal resistances for each structure. All results were gained through the computer simulations, which were done in ANSYS program. |
| Rights: | © 2012 Electroscope. All rights reserved. |
| Appears in Collections: | Číslo 6 - EDS 2012 (2012) Číslo 6 - EDS 2012 (2012) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| r6c6c6.pdf | 424,67 kB | Adobe PDF | View/Open |
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