| Title: | Aerosol Jet® bondování SMD součástek |
| Other Titles: | Aerosol Jet® SMD components bonding |
| Authors: | Navrátil, Jiří |
| Citation: | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 3.-4. listopadu 2016. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2016, s. [110-114]. |
| Issue Date: | 2016 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/26515 |
| ISBN: | 978–80–261–0516–9 |
| Keywords: | Aerosol Jet;bondování;tištěná elektronika;SMD |
| Keywords in different language: | Aerosol Jet;bonding;printed electronics;SMD |
| Abstract in different language: | This paper presents a research focused on Aerosol Jet® bonding of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies the new possibilities have raised. Except for using conductive adhesives the Aerosol Jet® technology can be used for contacting. |
| Rights: | © Západočeská univerzita v Plzni |
| Appears in Collections: | Konferenční příspěvky / Conference papers (KET) 2016 2016 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Navratil.pdf | Plný text | 491,25 kB | Adobe PDF | View/Open |
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