| Title: | Properties of thick printed copper films on alumina substrates |
| Authors: | Hlína, Jiří Řeboun, Jan Hamáček, Aleš |
| Citation: | HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Properties of thick printed copper films on alumina substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-5. ISBN 978-1-7281-1874-1 , ISSN 2161-2528. |
| Issue Date: | 2019 |
| Publisher: | IEEE |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | 2-s2.0-85072295975 http://hdl.handle.net/11025/36553 |
| ISBN: | 978-1-7281-1874-1 |
| ISSN: | 2161-2528 |
| Keywords in different language: | alumina;thick film;electrical parameters;copper |
| Abstract in different language: | This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on electrical, mechanical and thermal properties of these films. The changes of these properties depending on the thickness of TPC films are described in this paper. |
| Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
| Appears in Collections: | Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD |
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|---|---|---|---|
| Hlina_08810277_z IEEE.pdf | 1,21 MB | Adobe PDF | View/Open Request a copy |
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