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dc.contributor.authorNjawah Achiri, Humphrey Mokom
dc.contributor.authorŠmídl, Václav
dc.contributor.authorPeroutka, Zdeněk
dc.contributor.authorStreit, Luboš
dc.date.accessioned2021-01-18T11:00:21Z-
dc.date.available2021-01-18T11:00:21Z-
dc.date.issued2020
dc.identifier.citationNJAWAH ACHIRI, H. M., ŠMÍDL, V., PEROUTKA, Z., STREIT, L. Least squares method for indentification of IGBT thermal impedance networks using direct temperature measurements. Energies, 2020, roč. 13, č. 14, s. 1-13. ISSN 1996-1073.cs
dc.identifier.issn1996-1073
dc.identifier.uri2-s2.0-85089853175
dc.identifier.urihttp://hdl.handle.net/11025/42486
dc.format13 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherMDPIen
dc.relation.ispartofseriesEnergiesen
dc.rights© MDPIen
dc.titleLeast squares method for indentification of IGBT thermal impedance networks using direct temperature measurementsen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedState-of-the-art methods for determining thermal impedance networks for IGBT (Insulated Gate Bipolar Transistor) modules usually involves the establishment of the relationship between the measured transistor or diode voltage and temperature under homogenous temperature distribution across the IGBT module. The junction temperature is recomputed from the established voltage–temperature relationship and used in determining the thermal impedance network. This method requires accurate measurement of voltage drop across the transistors and diodes under specific designed heating and cooling profiles. Validation of the junction temperature is usually done using infrared camera or sensors placed close to the transistors or diodes (in some cases and open IGBT module) so that the measured temperature is as close to the junction as possible. In this paper, we propose an alternative method for determining the IGBT thermal impedance network using the principles of least squares. This method uses measured temperatures for defined heating and cooling cycles under di erent cooling conditions to determine the thermal impedance network. The results from the proposed method are compared with those obtained using state-of-the-art methods.en
dc.subject.translatedthermal impedanceen
dc.subject.translatedjunction temperatureen
dc.subject.translatedfoster networken
dc.subject.translatedCauer networken
dc.subject.translatedleast squaresen
dc.identifier.doi10.3390/en13143749
dc.type.statusPeer-revieweden
dc.identifier.document-number557665700001
dc.identifier.obd43931145
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
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