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Showing results 1 to 20 of 31
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Issue Date
Title
Author(s)
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Bend testing of SMD chip resistors glued on flexible substrates
Hirman, Martin
;
Neuhöfer, Tomáš
;
Steiner, František
2019
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
Hirman, Martin
;
Steiner, František
;
Navrátil, Jiří
;
Hamáček, Aleš
2013
Comparison of Rosin Fluxes
Rendl, Karel
;
Macháč, Jan
;
Steiner, František
;
Wirth, Václav
2019
Determination of changes in process management within industry
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2010
Effect of thermal stress and constitution of lead-free soldering alloys on creation and growth of IMC
Novák, Tomáš
;
Steiner, František
2007
Implementace bezolovnaté technologie pájení v elektronické výrobě
Steiner, František
;
Hamáček, Aleš
;
Skočil, Vlastimil
2019
Industry 4.0 and business process management
Tupa, Jiří
;
Steiner, František
2015
Influence of electrically conductive adhesive amount on shear strength of glued joints
Steiner, František
;
Hirman, Martin
2015
Innovated relays for railway signalling and interlocking
Konečný, Ivan
;
Kroupa, Michael
;
Polanský, Radek
;
Prosr, Pavel
;
Steiner, František
2007
Modelování a optimalizace diagnostických procesů
Tupa, Jiří
;
Steiner, František
;
Skočil, Vlastimil
2012
Multiplexer for automatic testing of multimedia units
Rendl, Karel
;
Blecha, Tomáš
;
Herc, Ladislav
;
Klocker, Lukáš
;
Linhart, Richard
;
Sehnal, Petr
;
Steiner, František
;
Wirth, Václav
2012
NZEE 2013 - Slovo úvodem
Pihera, Josef
;
Steiner, František
2019
Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Hirman, Martin
;
Steiner, František
2007
Použití laseru při výrobě microvia substrátů
Steiner, František
;
Hamáček, Aleš
;
Tupa, Jiří
2019
Project management during the industry 4.0 implementation with risk factor analysis
Hirman, Martin
;
Benešová, Andrea
;
Steiner, František
;
Tupa, Jiří
2019
Relationship of soldering profile, voids, formation and strength of soldered joints
Steiner, František
;
Wirth, Václav
;
Hirman, Martin
2019
Reliability of glued joints on flexible substrates during accelerated current ageing
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Hamáček, Aleš
2019
Requirements for education 4.0 and study programs within industry 4.0
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2020
The role of process management in the context of industry 4.0
Švehla, Michal
;
Řeřicha, Tomáš
;
Tupa, Jiří
;
Steiner, František