Browsing by Author Steiner, František

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Issue DateTitleAuthor(s)
2019Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateHirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš
2019Bend testing of SMD chip resistors glued on flexible substratesHirman, Martin; Neuhöfer, Tomáš; Steiner, František
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2013Comparison of Rosin FluxesRendl, Karel; Macháč, Jan; Steiner, František; Wirth, Václav
2019Determination of changes in process management within industryBenešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří
2010Effect of thermal stress and constitution of lead-free soldering alloys on creation and growth of IMCNovák, Tomáš; Steiner, František
2007Implementace bezolovnaté technologie pájení v elektronické výroběSteiner, František; Hamáček, Aleš; Skočil, Vlastimil
2019Industry 4.0 and business process managementTupa, Jiří; Steiner, František
2015Influence of electrically conductive adhesive amount on shear strength of glued jointsSteiner, František; Hirman, Martin
2015Innovated relays for railway signalling and interlockingKonečný, Ivan; Kroupa, Michael; Polanský, Radek; Prosr, Pavel; Steiner, František
2007Modelování a optimalizace diagnostických procesůTupa, Jiří; Steiner, František; Skočil, Vlastimil
2012Multiplexer for automatic testing of multimedia unitsRendl, Karel; Blecha, Tomáš; Herc, Ladislav; Klocker, Lukáš; Linhart, Richard; Sehnal, Petr; Steiner, František; Wirth, Václav
2012NZEE 2013 - Slovo úvodemPihera, Josef; Steiner, František
2019Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBsHirman, Martin; Steiner, František
2007Použití laseru při výrobě microvia substrátůSteiner, František; Hamáček, Aleš; Tupa, Jiří
2019Project management during the industry 4.0 implementation with risk factor analysisHirman, Martin; Benešová, Andrea; Steiner, František; Tupa, Jiří
2019Relationship of soldering profile, voids, formation and strength of soldered jointsSteiner, František; Wirth, Václav; Hirman, Martin
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2019Requirements for education 4.0 and study programs within industry 4.0Benešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří
2020The role of process management in the context of industry 4.0Švehla, Michal; Řeřicha, Tomáš; Tupa, Jiří; Steiner, František
Showing results 1 to 20 of 31  next >