Browsing by Author Hirman, M.
Showing results 1 to 3 of 3
|2019||Improvement of thick printed copper substrates solderability by formic acid||Michal, D.; Hirman, M.; Řeboun, J.|
|2019||Optimization of apertures shapes in stencil for eca printing to connecting of smd components on pcbs||Hirman, M.; Steiner, F.|
|2016||Temperature stable solder pastes: properties and reliability||Steiner, F.; Stuna, J.; Hirman, M.|