Browsing by Author Hirman, Martin

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Showing results 1 to 14 of 14
Issue DateTitleAuthor(s)
2019Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateHirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš
2019Bend testing of SMD chip resistors glued on flexible substratesHirman, Martin; Neuhöfer, Tomáš; Steiner, František
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2019Determination of changes in process management within industryBenešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří
2017Diagnostika propojovacích struktur součástek a substrátůHirman, Martin
2015Influence of electrically conductive adhesive amount on shear strength of glued jointsSteiner, František; Hirman, Martin
2018Kontaktování SMD součástek na flexibilní DPS s pomocí nevodivých lepidelNavrátil, Jiří; Hirman, Martin
2013Optimalizace skladových procesůHirman, Martin
2019Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBsHirman, Martin; Steiner, František
2019Project management during the industry 4.0 implementation with risk factor analysisHirman, Martin; Benešová, Andrea; Steiner, František; Tupa, Jiří
2019Relationship of soldering profile, voids, formation and strength of soldered jointsSteiner, František; Wirth, Václav; Hirman, Martin
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2019Requirements for education 4.0 and study programs within industry 4.0Benešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří
2019The testing of brass solderability for hybrid sewing threadPavec, Martin; Hirman, Martin; Soukup, Radek; Hamáček, Aleš