Title: Nonstandard unidirectional lamination for Face down technology
Authors: Lenger, T.
Pietriková, A.
Livovský, Ľ
Citation: Electroscope. 2019, č. 2.
Issue Date: 2019
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
ISSN: 1802-4564
Keywords: mechanické vlastnosti materiálů;analýza;face down technology;3-bodový ohybový test
Keywords in different language: mechanical properties of materials;analysis;face down technology;3-point bend test
Abstract in different language: This research is focused on analysing mechanical properties of materials which can be used for lamination of multilayer PCBs with embedded components by face down technology. Mechanical properties were analysed by 3-point bend test on various types of substrate material. Materials with low Tg and high Tg was used for testing. Laminate material, laminated prepreg material and also sandwich structure (combination of prepreg and laminate material) was tested. Lamination of prepreg materials was done by one step lamination and also by two step lamination. Sandwich structure has great potential for the purpose of components embedding and miniaturization of PCBs (Printed Circuit Boards) by face down technology.
Rights: Copyright © 2019 Electroscope. All Rights Reserved.
Appears in Collections:Číslo 2 (2019)
Číslo 2 (2019)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/36521

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