Název:	Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons
Autoři:	Hirman, Martin Navrátil, Jiří Steiner, František Řeboun, Jan Soukup, Radek Hamáček, Aleš
Citace zdrojového dokumentu:	HIRMAN, M. NAVRÁTIL, J. STEINER, F. ŘEBOUN, J. SOUKUP, R. HAMÁČEK, A. Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons. TEXTILE RESEARCH JOURNAL, 2022, roč. 92, č. 21-22, s. 4269-4287. ISSN: 0040-5175
Datum vydání:	2022
Nakladatel:	Sage
Typ dokumentu:	článek article
URI:	2-s2.0-85131350026 http://hdl.handle.net/11025/50301
ISSN:	0040-5175
Klíčová slova v dalším jazyce:	conductive stretchable textile ribbon nonconductive adhesive compression bonding e-textiles soldering aging and load testing
Abstrakt v dalším jazyce:	This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 omega even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70 degrees C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 m omega, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150 degrees C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.
Práva:	Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © authors
Vyskytuje se v kolekcích:	Články / Articles (KET) Články / Articles (RICE) OBD

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