Název:	Solderability dependence on surface roughness
Autoři:	Novák, Tomáš Starý, Jiří Steiner, František Stejskal, Petr
Citace zdrojového dokumentu:	Electroscope. 2009, Konference EDS 2009.
Datum vydání:	2009
Nakladatel:	Západočeská univerzita v Plzni, Fakulta elektrotechnická
Typ dokumentu:	konferenční příspěvek conferenceObject
URI:	http://147.228.94.30/images/PDF/Rocnik2009/EDS_2009/novak.pdf http://hdl.handle.net/11025/536
ISSN:	1802-4564
Klíčová slova:	pájitelnost;drsnost povrchu;elektrotechnická diagnostika
Klíčová slova v dalším jazyce:	solderability;surface roughness;electrical diagnostics
Abstrakt v dalším jazyce:	The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester.
Práva:	Copyright © 2007-2010 Electroscope. All Rights Reserved.
Vyskytuje se v kolekcích:	Konference EDS 2009 Články / Articles (KET) EDS 2009 (2009)

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