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dc.contributor.authorNicák, Michal
dc.contributor.authorPsota, Boleslav
dc.contributor.authorKosina, Petr
dc.contributor.authorStarý, Jiří
dc.contributor.authorŠandera, Josef
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2013-01-30T07:03:22Z
dc.date.available2013-01-30T07:03:22Z
dc.date.issued2012
dc.identifier.citationElectroscope. 2012, č. 6, EDS 2012.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/1044
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2012/Cislo6_2012/r6c6c3.pdf
dc.format5 s.
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rights© 2012 Electroscope. All rights reserved.en
dc.subjectnízkoteplotně vypalovaná keramikacs
dc.subjectsubstrátycs
dc.subject3D pájené spojecs
dc.titleProperties of 3D LTCC structure inteconnectionsen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting “zero shrink” Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.en
dc.subject.translatedlow temperature co-fired ceramicen
dc.subject.translatedsubstratesen
dc.subject.translated3D soldered interconnectionsen
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 6 - EDS 2012 (2012)
Číslo 6 - EDS 2012 (2012)

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