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dc.contributor.authorNovák, Tomáš
dc.contributor.authorMachač, Jan
dc.contributor.authorSteiner, František
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2013-01-30T08:12:13Z
dc.date.available2013-01-30T08:12:13Z
dc.date.issued2012
dc.identifier.citationElectroscope. 2012, č. 6, EDS 2012.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/1046
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2012/Cislo6_2012/r6c6c4.pdf
dc.format4 s.
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rights© 2012 Electroscope. All rights reserved.en
dc.subjecttestování pájitelnostics
dc.subjectinertní atmosféracs
dc.subjectdesky plošných spojůcs
dc.titleUsage of inert atmosphere for solderability testingen
dc.typečlánekcs
dc.typekonferenční příspěvekcs
dc.typearticleen
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThe article presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different atmospheres for solderability testing with different finishes of printed circuit boards (PCB’s). The article contains method descriptions that were used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative copper property is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere does not contain oxygen and prevents oxidation of the material used on PCB’s. The increasingly frequent introduction of inert atmospheres into soldering processes encourages the introduction of a inert atmosphere also in solderability testing processes.en
dc.subject.translatedsolderability testingen
dc.subject.translatedinert atmosphereen
dc.subject.translatedprinted circuit boardsen
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 6 - EDS 2012 (2012)
Články / Articles (KET)
Číslo 6 - EDS 2012 (2012)

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