In recent years, there has been significant development in the area of implementation of digitization, information systems and new technologies into production. This has led to the emergence of a new industrial revolution, known as Industry 4.0. This revolution will allow for increased&...

This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion A...

With the growing Smart Textile industry, there is currently increasing interest in mapping the possibilities and quality of contacting embroidered conductive patterns. This paper deals with one of the contacting options currently in use, the method of resistance welding. Furthermore, the pap...

This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton substrate, Aerosol Jet nanoparticle silver ink and two types of NCAs were used. The aim of the research is to create a reliable interconnection for&#x...

This paper deals with the design and realization of planar resonant circuits, which are part of a system designed to verify the authenticity of identity documents or banknotes. Validation or authentication is performed based on the evaluation of resonant frequency changes due to th...

Smart firefighter protective suits can monitor their inner and outer temperature in order to prevent the burning of sensitive human skin. Embroidered large area sensors, which were developed at the University of West Bohemia in cooperation with industrial partners, are ideal for this&#x...

The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton...

This paper presents a research focused on testing of brass solderability for hybrid sewing thread. The hybrid sewing thread is composed of two strands each containing 48 polyester (PES) fibers and 4 brass micro wires. As main investigative method was chosen spread test. Due to...

This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The th...

This paper deals with temperature distribution optimization in flexible printed circuit boards (FPCBs) with assembled temperature sensors. They are a part of a testing system, which is intended to be used for testing of the thermal protection level of protective gloves. In total 28...

This paper presents research focused on the development of a flexible fully printed IoT antenna for a drone-deployed autonomous sensor unit optimized for IoT applications. Aerosol Jet® was chosen as manufacturing technology. DuPont™ Kapton® HN 500 polyimide foil was used as a substrate....

This paper deals with reliability of joints glued by non-conductive adhesives (NCA) on flexible substrates during electrical current ageing. Also the comparison of NCA joints ageing with ECA joints ageing is presented in this paper. Two types of adhesives were used for the experime...

In this article we tackle the main problem of nanoparticles which is aglomeration, sedimentation and their long term stability. It has been proved that the nanoparticles offer various benefits for improving the electrical parameters (like breakdown voltage, dissipation factor tan,etc.) of in...