Název: Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles
Autoři: Janda, Martin
Rostás, Kateřina
Pretl, Silvan
Řeboun, Jan
Citace zdrojového dokumentu: JANDA, M. ROSTÁS, K. PRETL, S. ŘEBOUN, J. Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-6. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536
Datum vydání: 2022
Nakladatel: IEEE
Typ dokumentu: konferenční příspěvek
ConferenceObject
URI: 2-s2.0-85134243182
http://hdl.handle.net/11025/49769
ISBN: 978-1-66546-589-2
ISSN: 2161-2536
Klíčová slova v dalším jazyce: printed electronics;embroidered electronics;micro-dispensing
Abstrakt: This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.
Abstrakt v dalším jazyce: This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.
Práva: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
© IEEE
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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