Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Klčo, Peter | |
| dc.contributor.author | Koniar, Dusan | |
| dc.contributor.author | Hargas, Libor | |
| dc.contributor.author | Paskala, Marek | |
| dc.contributor.editor | Pinker, Jiří | |
| dc.date.accessioned | 2022-11-04T08:40:38Z | |
| dc.date.available | 2022-11-04T08:40:38Z | |
| dc.date.issued | 2022 | |
| dc.identifier.citation | 2022 International Conference on Applied Electronics: Pilsen, 6th – 7th September 2022, Czech Republic, p. 107-110. | en |
| dc.identifier.isbn | 978-1-6654-9482-3 | |
| dc.identifier.uri | http://hdl.handle.net/11025/49861 | |
| dc.description.sponsorship | APVV 20-0500 - Research of methodologies to increase the quality and lifetime of hybrid power semiconductor module | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | Fakulta elektrotechnická ZČU | cs |
| dc.rights | © IEEE | en |
| dc.subject | hybridní výkonový polovodič | cs |
| dc.subject | pájecí splash | cs |
| dc.subject | vizuální kontrola | cs |
| dc.subject | konvoluční neuronové sítě | cs |
| dc.subject | YOLOv5 algoritmus | cs |
| dc.title | Automated detection of soldering splashes using YOLOv5 algorithm | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | openAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | This paper deals with automated visual inspection of electronic boards in serial manufacturing of power electronics devices. Soldering splashes generated in the relevant phases of manufacturing can decrease the quality, parameters and lifetime of hybrid power semiconductor modules. Soldering splashes can occur in restricted area of electronic board and must be removed. Automated inspection is provided using neural network YOLO trained on image dataset of electronic boards acquired by authors in SEMIKRON Slovakia company. Implemented method will lead to higher reliability of manufacturing process. | en |
| dc.subject.translated | hybrid power semiconductor | en |
| dc.subject.translated | soldering splash | en |
| dc.subject.translated | visual inspection | en |
| dc.subject.translated | convolutional neural network | en |
| dc.subject.translated | YOLOv5 algorithm | en |
| dc.type.status | Peer-reviewed | en |
| Vyskytuje se v kolekcích: | Applied Electronics 2022 Applied Electronics 2022 | |
Soubory připojené k záznamu:
| Soubor | Popis | Velikost | Formát | |
|---|---|---|---|---|
| uvod.pdf | 1,61 MB | Adobe PDF | Zobrazit/otevřít | |
| Automated_detection_of_soldering_splashes_using_YOLOv5_algorithm.pdf | Plný text | 830,52 kB | Adobe PDF | Zobrazit/otevřít |
Použijte tento identifikátor k citaci nebo jako odkaz na tento záznam:
http://hdl.handle.net/11025/49861Všechny záznamy v DSpace jsou chráněny autorskými právy, všechna práva vyhrazena.