Title:	Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys
Authors:	Rous, Pavel Přibek, Petr Steiner, František
Citation:	ROUS, P. PŘIBEK, P. STEINER, F. Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys. In Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022. Pilsen: University of West Bohemia in Pilsen, 2022. s. nestránkováno. ISBN: 978-1-66548-082-6
Issue Date:	2022
Publisher:	University of West Bohemia in Pilsen
Document type:	konferenční příspěvek ConferenceObject
URI:	2-s2.0-85141358676 http://hdl.handle.net/11025/50539
ISBN:	978-1-66548-082-6
Keywords in different language:	intermetallic compound;intermetallic layers;solder alloy;thermal aging;reflow soldering
Abstract in different language:	This article will present the influence of thermal aging and the reflow cycle numbers on intermetallic layer growth. Search for the new soldering alloy brings a new and different combination of elements, which behave differently in work conditions. The objects of the experiment are five types of solder alloys, the referential alloy is SAC compared to SnNi based solder alloys combined with germanium, cobalt, phosphor, and copper elements. The results of the experiment will be the thickness of intermetallic layers between the copper pad and solder alloys in different combinations of thermal aging and reflow cycles. Values will be supported by the elemental analysis by the electron microscope using an EDS (Energy-dispersive X-ray spectroscopy) analysis. More details about the solder alloys and settings reflow and aging processes will be presented in the paper.
Rights:	© IEEE
Appears in Collections:	OBD

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