Title: Magnetically Assembled Electronic Digital Materials
Authors: Lapuník, Vojtěch
Juřík, Martin
Vítek, Martin
Kuthan, Jiří
Mach, František
Citation: LAPUNÍK, V. JUŘÍK, M. VÍTEK, M. KUTHAN, J. MACH, F. Magnetically Assembled Electronic Digital Materials. In Proceedings of the 5th International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS 2022). Piscataway: IEEE, 2022. s. 1-6. ISBN: 978-1-66545-973-0
Issue Date: 2022
Publisher: IEEE
Document type: konferenční příspěvek
ConferenceObject
URI: 2-s2.0-85139079506
http://hdl.handle.net/11025/51334
ISBN: 978-1-66545-973-0
Keywords in different language: minirobots;networks (circuits);robotic assembly;digital materials;magnetic actuation;planar robotic systems
Abstract: The concept of digital materials at the boundary of electric circuits and miniature robotics is studied. The main objective is to develop an experimental framework for the automatic assembly of basic electric circuits from the elementary modules. The framework is demonstrated on tiny modules, so-called bits, which take advantage of magnetic actuation and connection, both electrically and mechanically. The concept has potential application in small-scale robotics, especially for modular reconfigurable and versatile insect-scale robots, which can be used as elementary parts of complex reconfigurable machines.
Abstract in different language: The concept of digital materials at the boundary of electric circuits and miniature robotics is studied. The main objective is to develop an experimental framework for the automatic assembly of basic electric circuits from the elementary modules. The framework is demonstrated on tiny modules, so-called bits, which take advantage of magnetic actuation and connection, both electrically and mechanically. The concept has potential application in small-scale robotics, especially for modular reconfigurable and versatile insect-scale robots, which can be used as elementary parts of complex reconfigurable machines.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
© IEEE
Appears in Collections:Konferenční příspěvky / Conference Papers (KEP)
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