Title: | Sledovanie štruktúr spojov na báze zliatiny SAC |
Authors: | Pietriková, Alena Livovský, Ľubomír Ďurišin, Juraj |
Citation: | Electroscope. 2009, č. 2, výběr z konference Diagnostika. |
Issue Date: | 2009 |
Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
Document type: | článek konferenční příspěvek article conferenceObject |
URI: | http://147.228.94.30/images/PDF/Rocnik2009/cislo2_2009_Diagnostika/r3c2c5.pdf http://hdl.handle.net/11025/546 |
ISSN: | 1802-4564 |
Keywords: | pájené spoje;intermetalické slitiny;SAC |
Keywords in different language: | soldered joints;intermetallic alloys;SAC |
Abstract in different language: | Intermetallic compounds (IMCs) are essential part of lead-free solders microstructure. Presence of the IMCs results from solidification process of molten solder. In 96.5Sn3Ag0.5Cu (SAC305) solder is dominant element tin (Sn). But despite this Sn dominancy only 3% weight contain of silver (Ag) has strong influence on final structure of solid solder joint. Ag forms in volume of the solder hard Ag3Sn intermetallics significantly influencing especially mechanical properties of the joint. Fundamental impact on strength of solder joint has also interaction between the molten (or solid) solder and printed circuit board (PCB) pad. It forms IMC containig both Sn and PCB pad material (bare copper or surface coating). Therefore analysis of presence of IMCs in the solder joint is essential key to understand behaviour of lead-free solder joints. |
Rights: | Copyright © 2007-2010 Electroscope. All Rights Reserved. |
Appears in Collections: | Číslo 2 - výběr z konference Diagnostika (2009) Číslo 2 - výběr z konference Diagnostika (2009) |
Files in This Item:
File | Description | Size | Format | |
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r3c2c5.pdf | 525,45 kB | Adobe PDF | View/Open |
Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/546
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