Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Pekárek, Jan | |
| dc.contributor.author | Háze, Jiří | |
| dc.contributor.author | Pavlík, Michal | |
| dc.contributor.author | Vrba, Radimír | |
| dc.contributor.editor | Pihera, Josef | |
| dc.contributor.editor | Steiner, František | |
| dc.date.accessioned | 2012-11-01T09:30:40Z | |
| dc.date.available | 2012-11-01T09:30:40Z | |
| dc.date.issued | 2010 | |
| dc.identifier.citation | Electroscope. 2010, č. 3, EDS 2010. | cs |
| dc.identifier.issn | 1802-4564 | |
| dc.identifier.uri | http://147.228.94.30/images/PDF/Rocnik2010/Cislo3_2010_EDS/r4c3c12.pdf | |
| dc.identifier.uri | http://hdl.handle.net/11025/585 | |
| dc.format | 3 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | Západočeská univerzita v Plzni, Fakulta elektrotechnická | cs |
| dc.relation.ispartofseries | Electroscope | cs |
| dc.rights | Copyright © 2007-2010 Electroscope. All Rights Reserved. | en |
| dc.subject | anodické lepení | cs |
| dc.subject | aplikace MEMS | cs |
| dc.title | A novel laboratory anodic bonding device for MEMS applications | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | openAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 °C and by applying an external DC electric field in a range of 500 – 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass. | en |
| dc.subject.translated | anodic bonding | en |
| dc.subject.translated | MEMS applications | en |
| dc.type.status | Peer-reviewed | en |
| Vyskytuje se v kolekcích: | Číslo 3 - EDS 2010 (2010) Číslo 3 - EDS 2010 (2010) | |
Soubory připojené k záznamu:
| Soubor | Popis | Velikost | Formát | |
|---|---|---|---|---|
| r4c3c12.pdf | 514,99 kB | Adobe PDF | Zobrazit/otevřít |
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