Title: The increasing importance of the thermal management for modern electronic packages
Authors: Psota, Boleslav
Szendiuch, Ivan
Citation: Electroscope. 2012, č. 6, EDS 2012.
Issue Date: 2012
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: konferenční příspěvek
ISSN: 1802-4564
Keywords: teplotní management;elektronické pakety
Keywords in different language: electronic packages;thermal management
Abstract in different language: This paper deals with the significance of the thermal management for some modern types of electronic packages. The main part is focused on the Quad-Flat No-leads (QFN) package and its mounting ways and means, which depends significantly on their thermal characteristic. Apart from that, thermal properties of the Ball Grid Array (BGA) package were also calculated as well as thermal resistances for each structure. All results were gained through the computer simulations, which were done in ANSYS program.
Rights: © 2012 Electroscope. All rights reserved.
Appears in Collections:Číslo 6 - EDS 2012 (2012)
Číslo 6 - EDS 2012 (2012)

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