Title: | Mechanical Testing of Joints Glued/Soldered on Textile Ribbons |
Authors: | Hirman, M. Navrátil, J. Hamáček, A. Steiner, F. |
Citation: | Electroscope. 2020, č. 1. |
Issue Date: | 2020 |
Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
Document type: | článek article |
URI: | http://147.228.94.30/images/PDF/Rocnik2020/Cislo1_2020/r14c1c4.pdf http://hdl.handle.net/11025/42299 |
ISSN: | 1802-4564 |
Keywords: | stuha;výzkum;testování;odpor |
Keywords in different language: | textile ribbon;research;testing;resistance |
Abstract in different language: | This paper deals with the assembly of SMD chip resistors onto a conductive textile ribbon by soldering or gluing. The main goal of our research was to verify the reliability of joints after jerk testing of ribbons. The results showed that soldered / glued joints on electrically conductive textile ribbon are reliable during jerking test until the destruction of whole ribbon and electrical resistance of joints is low and stable until this destruction during extreme jerking. |
Rights: | © 2020 Electroscope |
Appears in Collections: | Články / Articles (KET) Číslo 1 (2020) Číslo 1 (2020) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
r14c1c4.pdf | Plný text | 712,79 kB | Adobe PDF | View/Open |
Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/42299
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