Title: | Sintering of printed Ag on ceramic substrates with the use of formic acid |
Authors: | Michal, David Janda, Martin Řeboun, Jan |
Citation: | MICHAL, D. JANDA, M. ŘEBOUN, J. Sintering of printed Ag on ceramic substrates with the use of formic acid. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 |
Issue Date: | 2021 |
Publisher: | IEEE |
Document type: | konferenční příspěvek ConferenceObject |
URI: | 2-s2.0-85113983389 http://hdl.handle.net/11025/49725 |
ISBN: | 978-1-66541-477-7 |
Keywords in different language: | printed electronics;pressureless sintering;formic acid vapours;silver-based paste |
Abstract: | This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used. |
Abstract in different language: | This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used. |
Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Appears in Collections: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
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