Title: | Kontaktování SMD součástek na flexibilní DPS s pomocí nevodivých lepidel |
Other Titles: | Connection of SMD Components on a Flexible PCB by Non-Conductive Adhesive |
Authors: | Navrátil, Jiří Hirman, Martin |
Citation: | Elektrotechnika a informatika 2018: XIX. ročník konference doktorských prací, Zámek Nečtiny, 25. – 26. října 2018: Elektrotechnika, Elektronika, Elektroenergetika, 2018, s. 120-124. |
Issue Date: | 2018 |
Publisher: | Západočeská univerzita v Plzni |
Document type: | konferenční příspěvek conferenceObject |
URI: | http://hdl.handle.net/11025/30719 |
ISBN: | 978–80–261–0785–9 |
Keywords: | elektricky vodivé lepidlo;flexibilní podklady;nevodivé lepidlo |
Keywords in different language: | electrically conductive adhesive;flexible substrates;Nonconductive adhesive |
Abstract in different language: | The paper deals with the connection of SMD chip resistors on the flexible substrate by electrically conductive and non-conductive adhesives. UV curable non-conductive adhesive and epoxy non-conductive adhesive were used in the experiment. The target of the experiment proved that the connection of component with substrate by non-conductive adhesive is possible and could be used as a replacement of electrically conductive adhesives in some applications. |
Appears in Collections: | Konferenční příspěvky / Conference papers (KET) 2018 2018 |
Files in This Item:
File | Description | Size | Format | |
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Navratil.pdf | Plný text | 445,69 kB | Adobe PDF | View/Open |
Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/30722
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